product_S9

S9_F.PNG

S9_B.PNG

Devices
BGA,CSP,BCC,MLF,QFN,QFP
Device Size
3.0×3.0mm ~ 50×50mm(depend on socket)
Index Time
Less than 0.35sec.
Throughput
up to 8500 (Depend on condition)
Contact pitch
Matrix : 4x2 Pitch : 40x60mm
Contact Mode
1~16ch
Jam rate
1/20,000
Optional
Kitless
ATC