Device |
BGA,CSP,BCC,MLF,QFN,QFP
|
|---|---|
Device Size |
□2.5mm - □60mm
|
Index time |
Less than 0.5sec
|
Throughput |
4,000
|
Contact pitch |
MAX 100x100mm
|
Contact mode |
Single,Dual,Triple,Square 4ch
|
Jam rate |
1/20,000
|
Optional |
2.0mm Device size
STC
Load Cell
Bent lead check
Mark Inspection
Multi-binning Unit
|