R4
| Device type | BGA, CSP, QFN, BCC, SQFP, TSOP |
|---|---|
| Device size | 1X1~100X100 (mm) |
| Device thickness | 0.4~5.0 (mm) |
| Temp range | -80 to 175 degrees |
| Max contact force | 80kgf |
| Index time | 9.5sec (11.3 with Precisor) |
| UPH | 1ch:380 (320 with precisor) |
| Test Site | Single |
| Jam rate | Single |
| Temp accuracy | ±3℃（-40 ～ +125℃）、±5℃（+125 ～ +175℃） |