![S1 Compact 3](https://www.synax.co.jp/wp-content/uploads/2019/11/S1-Compact-3-3.jpg)
S1 Compact 3
Device type | BGA, CSP, QFN, BCC, QFP, TSOP |
---|---|
Device size | 1X1~50X50 (mm) |
Device thickness | 0.4~5.0 (mm) |
Temp range | -40 to 150 degrees |
Max contact force | 85kgf (higher contact force op available) |
Index time | 6.6sec |
UPH | S1P:±1℃ |
Test Site | Single ~ |
Jam rate | 1/1000 |
Temp accuracy | ±3℃(-40 ~ +125℃)、±5℃(+125 ~ +175℃) *SP1は±1 |