S9

S9

Device typeBGA, CSP, QFN, QFP, SQFP, TSOP
Device size1X1~50X50 (mm) (Depends on condition)
Device thickness0.6~5.0 (mm)
Temp rangeUp to 150 degrees
Max contact force85kgf (225kgf option)
Index timeLess than 0.35sec
UPH8500
Test SiteSingle, Dual, Quad, Octal
Jam rate1/20000
Temp accuracy+50℃~+90℃・・・±2℃
+90℃~+130℃・・・±3℃
+130℃~+150℃・・・±5℃
PRODUCTS LIST
TOP > PRODUCTS > S9