S11
| Device type | BGA,CSP,QFN,QFP,TSOP |
|---|---|
| Device size | 2x2 - 65x65 (mm) |
| Device thickness | 0.6～5mm |
| Temp range | -55～+130 degrees (*op 175) |
| Max contact force | 240kgf |
| Index time | 1.0 sec |
| UPH | 6580 (8ch) |
| Test Site | Single, Dual, Quad, Octal,16ch (*Max 8ch in cold) |
| Jam rate | 1/5000 |
| Temp accuracy | ± 3 ℃ |