S12/13
| Device type | BGA,CSP,QFN,QFP,TSOP |
|---|---|
| Device size | 2x2 - 35x35 (mm) |
| Device thickness | 0.6～5mm |
| Temp range | up to 175 degrees (*op) |
| Max contact force | 240kgf |
| Index time | SQ16ch Room : 6.03 / High : 7.54 secs |
| UPH | 9000 |
| Test Site | Single, Dual, Quad, Octal, 16ch, 32ch |
| Jam rate | 1/20000 |
| Temp accuracy | ~+125 ℃…± 3 ℃ +125~+175 ℃…±5 ℃ |