S1B

S1B

Device typeBGA, CSP, QFN, BCC, QFP, TSOP
Device size1X1~50X50 (mm) 
Device thickness0.4~5.0 (mm)
Temp range-40 to 150 degrees
Max contact force85kgf (higher contact force op available)
Index time4.8sec
UPH1ch:700 / 2ch: 1400
Test SiteSingle ~
Jam rate1/1000
Temp accuracy±3℃(-40 ~ +125℃)、±5℃(+125 ~ +175℃)
PRODUCTS LIST
TOP > PRODUCTS > S1B