S3260
| Device type | WLP, QFN, PGA, BGA, CSP, Flip-chip, TSOP,QFP LT Board |
|---|---|
| Device size | 3x3 - 55x55 (mm) |
| Device thickness | 0.4~10mm |
| Temp range | up to 150 degrees |
| Max contact force | 100kgf |
| Index time | 2.5 secs |
| UPH | 1280 |
| Test Site | Single x 6 |
| Jam rate | 1/20000 |
| Temp accuracy | ~+125 ℃…± 3 ℃ +125~+150 ℃…±5 ℃ |