S9+HS

S9+HS

Device typeBGA, CSP, QFN, QFP, SQFP, TSOP
Device size1X1~50X50 (mm) (Depends on condition)
Device thickness0.6~5.0 (mm)
Temp rangeUp to 150 degrees
Max contact force120 kgf (480kgf option)
Index timeLess than 0.35sec
UPH16500
Test SiteSingle, Dual, Quad, Octal, 16ch, (32ch Op)
Jam rate1/20000
Temp accuracy+50℃~+90℃・・・±2℃
+90℃~+130℃・・・±3℃
+130℃~+150℃・・・±5℃
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