SX2400
| Device type | BGA, CSP, QFN, QFP, SQFP, TSOP |
|---|---|
| Device size | 3X3~50X50 (mm) (Depends on condition) |
| Device thickness | 0.4~5.0 (mm) |
| Temp range | -55 to 150 degrees |
| Max contact force | 85kgf (150/300kgf option) |
| Index time | Less than 0.8sec |
| UPH | 5000 |
| Test Site | Single, Dual, Quad,Octal |
| Jam rate | 1/5000 |
| Temp accuracy | ±3℃, ±5℃（+125.0℃～+150℃） |