SX2400

SX2400

Device typeBGA, CSP, QFN, QFP, SQFP, TSOP
Device size3X3~50X50 (mm) (Depends on condition)
Device thickness0.4~5.0 (mm)
Temp range-55 to 175 degrees
Max contact force85kgf (150/300kgf option)
Index timeLess than 0.8sec
UPH5000
Test SiteSingle, Dual, Quad,Octal
Jam rate1/5000
Temp accuracy ±3℃, ±5℃(+125.0℃~+175.0℃)
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